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Planibond Hi-Mod Gel

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Planibond Hi-Mod Gel

High-Modulus, Non-Sag, Structural Epoxy Adhesive

Planibond Hi-Mod Gel is a high-modulus, high-strength, moisture-tolerant, low-VOC, two-part, non-sag, structural epoxy adhesive designed for a wide variety of bonding and repair applications.

Related documentation

Technical Data Sheet
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Safety Data Sheet
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Specifications
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Sustainability Product Report
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Planibond Hi-Mod Gel is part of the lines:

Concrete Restoration Systems - Bonding Agents and Epoxy Adhesives

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