High-Modulus, Non-Sag, Structural Epoxy Adhesive
Planibond Hi-Mod Gel is a high-modulus, high-strength, moisture-tolerant, low-VOC, two-part, non-sag, structural epoxy adhesive designed for a wide variety of bonding and repair applications.
Technical Services at 1-800-992-6273
Customer Service at 1-800-426-2734 (1-800-42-MAPEI)