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Planibond Hi-Mod Gel

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Planibond Hi-Mod Gel

High-Modulus, Nonsag, Structural Epoxy Adhesive

Planibond Hi-Mod Gel is a high-modulus, high-strength, moisture-tolerant, low-VOC, two-part, nonsag, structural epoxy adhesive designed for a wide variety of bonding and repair applications.

1:1 mixing ratio
100%-solids, solvent-free product with low-VOC content
Nonsag, high-modulus and high-strength
Moisture-tolerant
Suitable for use as a pick-proof security sealant
May be extended with graded sands
Cures to a light gray color that is similar to concrete color

Related documentation

Technical Data Sheet

Safety Data Sheet

Product documentation

Concrete Restoration Systems Product Catalog

Product catalogs

Concrete Restoration Systems Product Catalog

Related Products

Planibond Hi-Mod Gel is part of the lines:

Concrete Restoration Systems - Bonding Agents and Epoxy Adhesives

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