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Planibond Hi-Mod Gel

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Planibond Hi-Mod Gel

High-Modulus, Nonsag, Structural Epoxy Adhesive

Planibond Hi-Mod Gel is a high-modulus, high-strength, moisture-tolerant, low-VOC, two-part, nonsag, structural epoxy adhesive designed for a wide variety of bonding and repair applications.

  • 1:1 mixing ratio
  • 100%-solids, solvent-free product with low-VOC content
  • Nonsag, high-modulus and high-strength
  • Moisture-tolerant
  • Suitable for use as a pick-proof security sealant
  • May be extended with graded sands
  • Cures to a light gray color that is similar to concrete color

Related documentation

Technical Data Sheet
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Safety Data Sheet
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Related Products

Planibond Hi-Mod Gel is part of the lines:

Concrete Restoration Systems - Bonding Agents and Epoxy Adhesives

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